Semiconductor assembly equipment market share 2017-2023, by production process

Published by
Thomas Alsop,
May 8, 2024
In 2023, die attach accounted for 23 percent of the global assembly equipment market, while wire bonding accounted for 18 percent. Other assembly methods such as inspection or dicing, or even other bonding, accounted for 43 percent of the market in 2023.

Semiconductor assembly equipment market share worldwide from 2017 to 2023, by production process

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Release date

March 2024

Region

Worldwide

Survey time period

2017 to 2023

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