Power consumption share in semiconductor fab 2015, by specific application

Breakdown of power consumption in a semiconductor fabrication plant, as of 2015, by specific application

CharacteristicShare of power consumption
Manufacturing equipment 45.6%
Exhaust 14.9%
Chilled water 12.9%
Ultrapure water (UPW) 9.5%
Nitrogen (N2) 6.2%
Clean dry air (CDA) 5.2%
Waste water 1.3%
Recirculated air 1.1%
Lighting 1.1%
Make-up air 0.9%
Bulk gases 0.7%
Automated material handling system (AMHS) 0.4%
Volatile organic compound (VOC) abatement 0.2%
Created with Highcharts 7.2.2Share of power consumption45.6%45.6%14.9%14.9%12.9%12.9%9.5%9.5%6.2%6.2%5.2%5.2%1.3%1.3%1.1%1.1%1.1%1.1%0.9%0.9%0.7%0.7%0.4%0.4%0.2%0.2%0%0%2.2%2.2%Manufacturing equipmentExhaustChilled waterUltrapure water (UPW)Nitrogen (N2)Clean dry air (CDA)Waste waterRecirculated airLightingMake-up airBulk gasesAutomated material handling system (AMHS)Volatile organic compound (VOC) abatementHot waterOther
0%2.5%5%7.5%10%12.5%15%17.5%20%22.5%25%27.5%30%32.5%35%37.5%40%42.5%45%47.5%50%52.5%
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Release date

July 2015

Region

Worldwide

Survey time period

2015

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